Thermal behavior of rigid and flexible composite-to-substrate strengthening

Author(s): Bogusław Zając, Arkadiusz Kwiecień
Paper category: Proceedings
Book title: Proceedings of the International Conference on Sustainable Materials Systems and Structures (SMSS2019) Durability, Monitoring and Repair of Structures
Editor(s): Ana Baričević, Marija Jelčić Rukavina, Domagoj Damjanović, Maurizio Guadagnini
ISBN: 978-2-35158-217-6
e-ISBN: 978-2-35158-218-3
Publisher: RILEM Publications SARL
Publication year: 2019
Pages: 692-699
Total Pages: 848
Language: English

Abstract: This paper presents influence of elevated temperatures as well as of a thermal stress factor and glass transition temperature of stiff and flexible adhesives on strain distribution of composite-to-substrate strengthening. Various substrates as concrete, brick and timber were also considered. Single lap shear test was taken for analysis with constant load of 5 kN. Specimens consisted of a composite CFRP laminate were bonded to concrete, brick and timber substrates using stiff epoxy Sikadur 30 and 330 (S30 and S330) and highly deformable polyurethane Sika®PS (PS) adhesives. They were tested under 4 levels of temperature: 20, 40, 60 and 80 Celsius degrees. Changes of strain distributions at the composite surface were measured by strain gauges and compared graphically, indicating changes in strain distribution behaviour under thermal influences and constant load. Obtained results are presented in relation to temperature changes, substrate changes and adhesive changes. Comparison of them indicates that flexible polyurethane adhesive works stable in elevated temperatures, stiff epoxy adhesives work unstable in elevated temperatures when their glass transition temperature is reached or exceed. These results help understand durability aspects of composite-to-substrate strengthening when it works under load in elevated temperatures.

Online publication :2019
Publication type : full_text
Public price (Euros) : 00

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